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High Bandwidth Memory | backplane

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High Bandwidth Memory

HighActive

HBM supply is concentrated among SK Hynix, Micron, and Samsung. The bottleneck persists due to low manufacturing yields of 12-layer HBM3E stacks and the synchronization of HBM delivery with TSMC's CoWoS packaging schedules. Allocation remains tight as demand from AI accelerator ramps (NVIDIA Blackwell, AMD MI325X) outpaces capacity expansions through 2025.

Source Companies(control or create this constraint)

Affected Companies(impacted by this constraint)

Severity Assessment

High

4/5

This constraint is significantly impacting supply and requires attention.

Affected Segments

Packaging & Test

Current Status

Active

This bottleneck is currently constraining supply.