Supply Chain Bottlenecks
Current constraints and chokepoints across the semiconductor ecosystem.
High Bandwidth Memory
HighActiveHBM supply concentrated among SK Hynix, Samsung, and Micron. Bottleneck driven by low yields on 12-layer HBM3E and TSMC CoWoS packaging capacity limits. Demand from NVIDIA Blackwell and AMD MI325X continues to outpace expansions into 2025.
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Affected
Advanced Node Capacity
HighActiveLeading-edge manufacturing capacity (3nm and the upcoming 2nm) remains highly concentrated. TSMC holds over 90% of the advanced foundry market share. The bottleneck is exacerbated by the simultaneous demand for AI accelerators and mobile SoCs, while 2nm capacity is already being pre-booked for 2025-2026 production.
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GPU Export Controls
HighActiveUS export controls and prioritization policies restrict high-end AI GPU shipments. Affects NVIDIA, AMD, and downstream AI infrastructure globally. China restrictions and retaliatory import bans compound supply uncertainty.