Intel
INTCVerifiedUS-based semiconductor manufacturer historically focused on CPUs and currently expanding its foundry business. As of 2025, the company is partially owned by the United States government and was ranked as the world's third-largest chip manufacturer by revenue in 2024.
30-Day Price History
Related Bottlenecks
Glass Substrates
Glass substrates are emerging as replacements for organic substrates in advanced packaging. Required for next-gen chiplets and high-density interconnects. Production capacity is extremely limited with Intel, Samsung, and substrate makers racing to scale.
EUV Lithography
ASML remains the sole global supplier of EUV lithography systems. Standard EUV (0.33 NA) is essential for 7nm through 3nm nodes, while the transition to High-NA EUV (0.55 NA) is now the critical path for sub-2nm production. Despite capacity expansion targets of 90 standard units and 20 High-NA units by 2025-2026, the complexity of the optical and light-source supply chain maintains high lead times and limits rapid scaling by leading-edge foundries.
DRAM Capacity
Standard DRAM production is concentrated in Samsung, SK Hynix, and Micron. While less acute than HBM constraints, DRAM supply remains cyclical with capacity additions requiring 18-24 month lead times. Server DRAM demand continues growing with AI workloads.