TSMC
TSMVerifiedWorld's largest dedicated independent ('pure-play') semiconductor foundry. Produces ~90% of advanced logic chips (<7nm). Taiwan's largest company by market cap; majority foreign-owned with government as top shareholder. Accounts for ~30% of Taiwan Stock Exchange main index; Taiwan IC exports (~25% GDP) heavily reliant on TSMC.
30-Day Price History
Related Bottlenecks
CoWoS Advanced Packaging
TSMC's CoWoS packaging remains the critical bottleneck for high-end AI accelerators. Despite significant capacity expansion through 2024, the shift to next-generation architectures like NVIDIA's Blackwell (utilizing CoWoS-L) and AMD's Instinct MI325X maintains a supply-demand gap. Availability is governed by packaging throughput rather than front-end wafer fabrication.
Advanced Node Capacity
Leading-edge manufacturing capacity (3nm and the upcoming 2nm) remains highly concentrated. TSMC holds over 90% of the advanced foundry market share. The bottleneck is exacerbated by the simultaneous demand for AI accelerators and mobile SoCs, while 2nm capacity is already being pre-booked for 2025-2026 production.
EUV Lithography
ASML remains the sole global supplier of EUV lithography systems. Standard EUV (0.33 NA) is essential for 7nm through 3nm nodes, while the transition to High-NA EUV (0.55 NA) is now the critical path for sub-2nm production. Despite capacity expansion targets of 90 standard units and 20 High-NA units by 2025-2026, the complexity of the optical and light-source supply chain maintains high lead times and limits rapid scaling by leading-edge foundries.