TSMC
TSMVerifiedTaiwan Semiconductor Manufacturing Company Limited (TSMC) is a Taiwanese multinational semiconductor contract manufacturing (foundry) company headquartered in Hsinchu Science Park. It is the world's leading dedicated contract chipmaker, holding approximately 70% of the global foundry market share. The company serves as the primary manufacturing supplier for major fabless firms including Nvidia, Apple, Broadcom, and Qualcomm. Its growth has accelerated due to the artificial intelligence boom and the demand for advanced AI chips, while its concentrated role as a supply chain bottleneck creates systemic risk for the global semiconductor industry. The government of the Republic of China (Taiwan) is the largest individual shareholder, but the majority of the company is owned by foreign investors. In 2025, TSMC was ranked 38th in the Forbes Global 2000. Taiwan's integrated circuit exports reached $184 billion in 2022 (nearly 25% of Taiwan's GDP), and TSMC constitutes approximately 30% of the Taiwan Stock Exchange's weighting.
30-Day Price History
Related Bottlenecks
CoWoS Advanced Packaging
TSMC's CoWoS packaging remains the critical bottleneck for high-end AI accelerators. Despite significant capacity expansion through 2024, the shift to next-generation architectures like NVIDIA's Blackwell (utilizing CoWoS-L) and AMD's Instinct MI325X maintains a supply-demand gap. Availability is governed by packaging throughput rather than front-end wafer fabrication.
Advanced Node Capacity
Leading-edge manufacturing capacity (3nm and the upcoming 2nm) remains highly concentrated. TSMC holds over 90% of the advanced foundry market share. The bottleneck is exacerbated by the simultaneous demand for AI accelerators and mobile SoCs, while 2nm capacity is already being pre-booked for 2025-2026 production.
EUV Lithography
ASML remains the sole global supplier of EUV lithography systems. Standard EUV (0.33 NA) is essential for 7nm through 3nm nodes, while the transition to High-NA EUV (0.55 NA) is now the critical path for sub-2nm production. Despite capacity expansion targets of 90 standard units and 20 High-NA units by 2025-2026, the complexity of the optical and light-source supply chain maintains high lead times and limits rapid scaling by leading-edge foundries.