AMD
AMDVerifiedDeveloper of CPUs, GPUs, FPGAs, SoCs, and high-performance components, headquartered in Santa Clara, CA with operations in Austin, TX. Supplies data centers, gaming, AI, and embedded markets. Post-Xilinx acquisition, competes with NVIDIA and Intel in high-performance computing.
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Related Bottlenecks
CoWoS Advanced Packaging
TSMC's CoWoS packaging remains the critical bottleneck for high-end AI accelerators. Despite significant capacity expansion through 2024, the shift to next-generation architectures like NVIDIA's Blackwell (utilizing CoWoS-L) and AMD's Instinct MI325X maintains a supply-demand gap. Availability is governed by packaging throughput rather than front-end wafer fabrication.
High Bandwidth Memory
HBM supply is concentrated among SK Hynix, Micron, and Samsung. The bottleneck persists due to low manufacturing yields of 12-layer HBM3E stacks and the synchronization of HBM delivery with TSMC's CoWoS packaging schedules. Allocation remains tight as demand from AI accelerator ramps (NVIDIA Blackwell, AMD MI325X) outpaces capacity expansions through 2025.
Advanced Node Capacity
Leading-edge manufacturing capacity (3nm and the upcoming 2nm) remains highly concentrated. TSMC holds over 90% of the advanced foundry market share. The bottleneck is exacerbated by the simultaneous demand for AI accelerators and mobile SoCs, while 2nm capacity is already being pre-booked for 2025-2026 production.