Samsung Memory
005930.KSKRXVerifiedLargest memory chip maker globally by market share in DRAM, NAND flash, and HBM, pending confirmation from latest industry reports (e.g., Q3/Q4 2024 data).
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(3)Related Bottlenecks
High Bandwidth Memory
HBM supply is concentrated among SK Hynix, Micron, and Samsung. The bottleneck persists due to low manufacturing yields of 12-layer HBM3E stacks and the synchronization of HBM delivery with TSMC's CoWoS packaging schedules. Allocation remains tight as demand from AI accelerator ramps (NVIDIA Blackwell, AMD MI325X) outpaces capacity expansions through 2025.
DRAM Capacity
Standard DRAM production is concentrated in Samsung, SK Hynix, and Micron. While less acute than HBM constraints, DRAM supply remains cyclical with capacity additions requiring 18-24 month lead times. Server DRAM demand continues growing with AI workloads.