Samsung Memory
005930.KSKRXVerifiedLargest memory chip maker globally by market share in DRAM, NAND flash, and HBM per available data through Q3 2024 (e.g., TrendForce); pending confirmation from Q4 2024 industry reports.
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(3)Related Bottlenecks
High Bandwidth Memory
HBM supply concentrated among SK Hynix, Samsung, and Micron. Bottleneck driven by low yields on 12-layer HBM3E and TSMC CoWoS packaging capacity limits. Demand from NVIDIA Blackwell and AMD MI325X continues to outpace expansions into 2025.
DRAM Capacity
Standard DRAM production is concentrated in Samsung, SK Hynix, and Micron. While less acute than HBM constraints, DRAM supply remains cyclical with capacity additions requiring 18-24 month lead times. Server DRAM demand continues growing with AI workloads.