SK Hynix
000660.KSKRXVerifiedNo update is required. The description is accurate and current. If one wished to align it word-for-word with the Wikipedia phrasing, one could expand 'DRAM' to 'dynamic random-access memory (DRAM)' and add '(formerly Hewlett-Packard)' after 'Hewlett Packard Enterprise', but these are editorial refinements, not factual corrections.
30-Day Price History
Related Bottlenecks
High Bandwidth Memory
HBM supply concentrated among SK Hynix, Samsung, and Micron. Bottleneck driven by low yields on 12-layer HBM3E and TSMC CoWoS packaging capacity limits. Demand from NVIDIA Blackwell and AMD MI325X continues to outpace expansions into 2025.
DRAM Capacity
Standard DRAM production is concentrated in Samsung, SK Hynix, and Micron. While less acute than HBM constraints, DRAM supply remains cyclical with capacity additions requiring 18-24 month lead times. Server DRAM demand continues growing with AI workloads.